Micro tool material upgrade, semiconductor processing accuracy improvement
Release time:2025-10-30
In response to the demand for semiconductor packaging, ultra-fine grain hard alloy micro cutting tools have been launched, with a minimum diameter of 0.08mm and a rounded edge accuracy controlled within 5 μ m. This cutting tool adopts nanoscale powder pressing technology, which increases the rigidity by 40% compared to traditional products. It achieves burr free cutting in chip pin slot processing, and the processing qualification rate has increased from 92% to 99.5%. With the trend of miniaturization in consumer electronics, the market size of micro cutting tools is expected to reach 2.2 billion US dollars by 2025, with a compound annual growth rate of 18%.
Every KLAKEN knife is a tool, a statement, and a promise—engineered for those who demand excellence.
Contact Us
Contacts: Homan